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TSE387
  • TSE387

TSE387

GIS20965

SNAPSIL™ TSE387 – Neutral-Cure, Flowable Silicone Adhesive Sealant for Industrial and Electrical Applications

SNAPSIL™ TSE387 is a one-component, ready-to-use, flowable silicone adhesive sealant that cures at room temperature upon exposure to atmospheric moisture, forming a flexible, elastic silicone rubber with excellent adhesion and electrical insulation properties. Unlike acetoxy-cure silicones, TSE387 utilises an oxime-based neutral cure system, making it non-corrosive to copper and other sensitive metals, ideal for electrical assemblies, industrial enclosures, and environments where long-term material compatibility is critical.

With a flowable consistency (60 Pa·s) and extended tack-free time of 90 minutes, TSE387 is well-suited for applications requiring self-levelling coverage, thin-section potting, or filling of intricate geometries. It bonds primerlessly to metals, glass, ceramics, and many plastics, simplifying processing while delivering reliable protection against moisture, dust, ozone, and environmental stress.

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TSE387

TSE387

SNAPSIL™ TSE387 – Neutral-Cure, Flowable Silicone Adhesive Sealant for Industrial and Electrical Applications

SNAPSIL™ TSE387 is a one-component, ready-to-use, flowable silicone adhesive sealant that cures at room temperature upon exposure to atmospheric moisture, forming a flexible, elastic silicone rubber with excellent adhesion and electrical insulation properties. Unlike acetoxy-cure silicones, TSE387 utilises an oxime-based neutral cure system, making it non-corrosive to copper and other sensitive metals, ideal for electrical assemblies, industrial enclosures, and environments where long-term material compatibility is critical.

With a flowable consistency (60 Pa·s) and extended tack-free time of 90 minutes, TSE387 is well-suited for applications requiring self-levelling coverage, thin-section potting, or filling of intricate geometries. It bonds primerlessly to metals, glass, ceramics, and many plastics, simplifying processing while delivering reliable protection against moisture, dust, ozone, and environmental stress.

 

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Key Features

  • Neutral oxime cure chemistry – non-corrosive to copper, brass, and other sensitive metals
  • Flowable consistency – self-levels to coat complex shapes and penetrate tight spaces
  • Wide service temperature range: –55°C to 200°C (–67°F to 392°F)
  • Excellent electrical insulation:
  • Dielectric strength: 20 kV/mm
  • Volume resistivity: 1.0 × 10¹⁵ Ω·cm
  • Primerless adhesion to a broad range of substrates
  • Excellent weatherability, ozone resistance, and UV stability
  • Available in translucent, black, and white for visual or aesthetic requirements

Typical Applications

  • Thin-section potting and encapsulation of electrical components
  • Sealing of industrial control housings, sensor modules, and power units
  • Protective coating for PCBs and electronic assemblies requiring copper compatibility
  • General-purpose bonding of metal, glass, ceramic, and engineered plastics

Technical Notes

  • Tensile strength: 2.3 MPa (335 psi)
  • Elongation: 350% – provides flexibility under thermal cycling
  • Cured hardness: 25 Shore A
  • Adhesive strength (aluminium lap shear): 1.3 MPa
  • Tack-free time: 90 minutes at 23°C / 50% RH
  • Full cure (3 mm): ~7 days at room temperature
  • Maximum recommended thickness: 6 mm (¼ in.)

Certifications & Compliance

  • Meets electronics industry standards for non-corrosive sealants
  • UL Recognised under Component Recognition Program (File No. E-36952)

Packaging Options

  • Available in caulking cartridges and bulk containers, with Translucent, Black, and White options (subject to availability)

Processing Recommendations

  • Apply to clean, dry surfaces, no primer required for most substrates
  • Ideal for pour, dip, or automated dispensing due to its flowable nature
  • Ensure ambient humidity (>25% RH) for optimal cure

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