EGel3000

Reference: CHT-EGel3000

EGel3000 – Low-Viscosity, Transparent Silicone Gel for Sensitive Electronics Encapsulation

EGel 3000 is a two-component, 100% solids, addition-cure silicone gel engineered for the gentle yet effective protection of sensitive electronic components. Supplied in a 1:1 mix ratio by weight, it offers very low mixed viscosity (630 cP) and cures at room temperature to form a soft, transparent, resilient gel that cushions against vibration, thermal shock, and mechanical stress without damaging delicate wires, bonds, or semiconductor dies.

Designed for applications such as water flow meter potting, EGel 3000 provides excellent dielectric insulation, environmental sealing against moisture and contaminants, and easy visual inspection due to its optical clarity. Its repairable nature allows for field rework or component replacement when needed.

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Key Features

1:1 mix ratio by weight – simplifies manual or automated dispensing
Very low viscosity (630 cP) – flows easily into tight spaces and complex assemblies
Transparent, colourless cure – enables visual inspection of encapsulated parts
Soft gel consistency – Shore 00 equivalent penetration: 2.5 mm (19.5 g cone)
Addition-cure chemistry – no corrosive by-products; fully non-exothermic
Wide service temperature range: –55°C to 200°C (–67°F to 392°F)
Excellent electrical properties:
Dielectric strength: >470 V/mil
Volume resistivity: 2.0 × 10¹⁵ Ω·cm
Repairable and reworkable – ideal for serviceable electronics

Typical Applications

Potting of water flow meters, sensors, and transducers
Encapsulation of PCBs, MEMS devices, and wire-bonded assemblies
Protection of automotive, industrial, and utility electronics exposed to vibration or moisture
Applications requiring transparency and low-stress gel encapsulation

Technical Notes

Cure options: <24 hours at 23°C (73°F) for demold and handling, and an Accelerated cure is possible at elevated temperatures
Pot life: >45 minutes at 23°C
Thermal conductivity: 0.18 W/m·K
Dielectric constant (1 kHz): 2.82
Dissipation factor (1 kHz): 0.0014
Density: 0.97 g/cm³ (both A and B)
Self-bonding: Limited inherent tack; for strong adhesion, use with primer

Processing Recommendations

Mix Components A (transparent) and B (transparent) 1:1 by weight in a clean container (3× material volume)
Degassing under 30–50 mbar vacuum is recommended to eliminate entrapped air.