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TufGel330
CHT-Tufgel330
TufGel330 – Repairable, Soft Silicone Gel for Sensitive Electronics Encapsulation
TufGel330 is a two-component, 100% solids, addition-cure silicone gel engineered for the gentle yet robust protection of sensitive electronic components. With a 1:1 mix ratio by weight and low mixed viscosity (800 cP), it flows easily into complex assemblies, providing exceptional cushioning against vibration, thermal shock, and mechanical stress, all while minimising stress on delicate wires, bonds, and semiconductors.
Cured to a soft, tacky elastomer (Shore 00 hardness 30–55), TufGel 330 maintains conformal contact with components without rigid constraint. Its transparent, colourless appearance allows for visual inspection, and its repairable nature enables rework or component replacement when needed. Ideal for aerospace, automotive, medical, and power electronics, TufGel 330 delivers excellent dielectric properties and long-term environmental sealing against moisture, dust, and contaminants.
Key Features
- Ultra-low modulus gel – minimises stress on fragile components
- Inherent surface tack – enhances mechanical adhesion without chemical bonding
- 1:1 mix ratio by weight – simplifies manual or automated dispensing
- Transparent and colourless – enables visual inspection of encapsulated parts
- Repairable – potted assemblies can be accessed and reworked
- Addition-cure chemistry – no corrosive by-products; fully non-corrosive
- Wide service temperature range: –55°C to 204°C (–67°F to 399°F)
- Excellent electrical insulation and environmental resistance
Typical Applications
- Encapsulation of LED arrays, sensors, and MEMS devices
- Potting of automotive control units, battery modules, and connectors
- Protection of aerospace and medical electronics requiring stress relief
- Conformal gel coating for high-reliability PCBs in harsh environments
Technical Notes
- Cure options: 24 hours at 25°C (room temperature) 60 minutes at 100°C & 30 minutes at 150°C
- Pot life: 70 minutes at 25°C
- Viscosity (each part): 800 cP (Newtonian flow)
- Specific gravity: 0.97 (both A and B)
- Non-corrosive and non-halogen
- Self-bonding: Limited tack adhesion; for strong chemical adhesion, use with appropriate primer
- Cure inhibition sensitivity: Avoid contact with sulphur-, nitrogen-, tin-, or PVC-based materials (e.g., latex gloves, sulphur-cured rubbers, condensation-cure silicones)
Processing Recommendations
- Mix Components A (transparent) and B (transparent) 1:1 by weight in a clean container (3× material volume)
- Stir thoroughly to ensure homogeneity; degassing under 30–50 mbar vacuum is recommended.
- For automated dispensing, use purged static mixers; ensure no cross-contamination with condensation-cure silicones or inhibitor sources.
Storage & Shelf Life
- Shelf life: 24 months in original
- Max storage temperature: 38°C (100°F)
- Store in a cool, dry place away from direct sunlight and moisture
Packaging Options
Available in matched A/B kits in small & bulk containers for manual or automated meter mix dispense systems.
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TufGel330 – Repairable, Soft Silicone Gel for Sensitive Electronics Encapsulation
TufGel330 is a two-component, 100% solids, addition-cure silicone gel engineered for the gentle yet robust protection of sensitive electronic components. With a 1:1 mix ratio by weight and low mixed viscosity (800 cP), it flows easily into complex assemblies, providing exceptional cushioning against vibration, thermal shock, and mechanical stress, all while minimising stress on delicate wires, bonds, and semiconductors.
Cured to a soft, tacky elastomer (Shore 00 hardness 30–55), TufGel 330 maintains conformal contact with components without rigid constraint. Its transparent, colourless appearance allows for visual inspection, and its repairable nature enables rework or component replacement when needed. Ideal for aerospace, automotive, medical, and power electronics, TufGel 330 delivers excellent dielectric properties and long-term environmental sealing against moisture, dust, and contaminants.