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TSE399-C
GEE20661
TSE399 (Clear) – Flowable, Fast-Cure, Non-Corrosive Silicone Encapsulant for Electronics Protection
TSE399 is a one-component, ready-to-use, flowable silicone encapsulant that cures rapidly at room temperature upon exposure to atmospheric moisture, forming a soft, elastic, dielectric silicone rubber. Designed for electrical and electronic applications, TSE399 offers excellent primerless adhesion to metals, plastics, glass, and ceramics, without corroding sensitive conductors such as copper or brass.
Unlike acetoxy-cure silicones, TSE399 utilises an alkoxy (alcohol-based) cure system, releasing only a slight, non-objectionable alcohol odour, making it ideal for indoor or confined assembly environments. Its low-viscosity, flowable consistency (2,500 cP) ensures complete coverage of complex geometries, fine leads, and densely packed components, providing reliable protection against moisture, thermal shock, vibration, and environmental contaminants.
Key Features
- Non-corrosive to metals – meets MIL-A-46146A corrosion requirements
- Fast tack-free time: 10 minutes at 23°C / 50% RH
- Flowable consistency – self-levels to coat intricate assemblies and penetrate tight spaces
- Soft cured elastomer (30 Shore A) – cushions components against mechanical and thermal stress
- Wide service temperature range: –55°C to 200°C (–67°F to 392°F)
- Excellent electrical insulation:
- Dielectric strength: 22 kV/mm (560 V/mil)
- Volume resistivity: 2.0 × 10¹⁵ Ω·cm
- Primerless adhesion to most substrates, including engineering plastics
- UL 94 HB recognised (File No. E56745)
Typical Applications
- Conformal coating and potting of PCBs, sensors, and semiconductor packages
- Environmental sealing of connectors, relays, and high-voltage components
- Encapsulation of automotive electronics, communication modules, and power supplies
- Protection of assemblies requiring full coverage in hard-to-reach areas
Technical Notes
- Viscosity: 2,500 cP (at 25°C)
- Cured hardness: 30 Shore A
- Tensile strength: 13 kgf/cm² (185 psi)
- Elongation: 140%
- Maximum recommended thickness: 6 mm (¼ in.) – standard for moisture-cure silicones
- Cure by-product: Alcohol vapour (low odour, non-corrosive)
- Full cure (3 mm): ~48 hours at 25°C / 50% RH
Certifications & Compliance
- MIL-A-46146A – Passes corrosion test
- UL 94 HB – Recognised for flammability (File No. E56745)
Packaging Options
- Available in clear in 100 g collapsible tubes (cases of 20) & 333 ml caulking cartridges (cases of 10)
Processing Recommendations
- Apply to clean, dry surfaces – no primer required for most substrates
- Ideal for dip, pour, or automated dispensing due to its flowable nature
- Avoid use with polyethylene, polypropylene, or PTFE without surface treatment
- Ensure adequate humidity (>25% RH) for optimal cure
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TSE399 (Clear) – Flowable, Fast-Cure, Non-Corrosive Silicone Encapsulant for Electronics Protection
TSE399 is a one-component, ready-to-use, flowable silicone encapsulant that cures rapidly at room temperature upon exposure to atmospheric moisture, forming a soft, elastic, dielectric silicone rubber. Designed for electrical and electronic applications, TSE399 offers excellent primerless adhesion to metals, plastics, glass, and ceramics, without corroding sensitive conductors such as copper or brass.
Unlike acetoxy-cure silicones, TSE399 utilises an alkoxy (alcohol-based) cure system, releasing only a slight, non-objectionable alcohol odour, making it ideal for indoor or confined assembly environments. Its low-viscosity, flowable consistency (2,500 cP) ensures complete coverage of complex geometries, fine leads, and densely packed components, providing reliable protection against moisture, thermal shock, vibration, and environmental contaminants.