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QSIL573 (2KG KIT)
QSIL573 (2KG KIT)
QSIL™ 573 – (Grey) Thermally Conductive, Repairable Addition-Cure Silicone for Electronics Potting
QSIL 573 is a two-component, 100% solids, addition-cure silicone elastomer engineered for high-performance potting and encapsulation of sensitive electronic assemblies. With a 1:1 mix ratio by weight, it delivers excellent thermal conductivity (~0.9–1.19 W/m·K), robust mechanical protection, and reliable environmental sealing while remaining fully repairable for rework or component replacement.
Curing rapidly at elevated temperatures (e.g., 15 minutes at 150°C) or fully at room temperature in 24 hours, QSIL 573 forms a hard, durable elastomer (Shore A 55) with low modulus to minimise stress on delicate components. Its grey cured appearance and non-corrosive, platinum-cure chemistry make it ideal for power electronics, LED systems, automotive control units, and other applications requiring thermal management and long-term reliability.
Key Features
- High thermal conductivity: 0.9–1.19 W/m·K
- 1:1 mix ratio by weight – simplifies dispensing and ensures consistent performance
- Addition-cure system – no by-products, non-corrosive, and fully repairable
- UL 94 V-0 rated at 3.0 mm thickness (meets flammability requirements)
- Wide service temperature range: –55°C to 204°C (–67°F to 400°F)
- Excellent protection against moisture, dust, vibration, and mechanical shock
- Low mixed viscosity (5,500 cP) – enables easy mixing, degassing, and flow into complex geometries
Typical Applications
- Potting of power modules, LED drivers, and high-brightness LED arrays
- Encapsulation of automotive sensors, battery management systems, and inverters
- Protection of industrial control boards in harsh environments
- Applications requiring thermal dissipation and future rework capability
Technical Notes
- Pot life: 60–155 minutes at 25°C (depending on batch and handling)
- Tensile strength: 1.1 MPa (160 psi)
- Elongation: 40% – provides rigidity with minimal flexibility
- Dielectric strength: Not explicitly listed, but suitable for standard electronic insulation
- Self-bonding: No adhesion to substrates may require surface preparation or priming
- Inhibition sensitivity: Avoid contact with sulphur, nitrogen, tin, or PVC-based materials that can inhibit cure
- Cure options:
- Fast cure: 15 min at 150°C
- Room-temperature cure: 24 hours at 25°C / 50% RH
Processing Recommendations
- Mix Components A (white) and B (grey) 1:1 by weight in a clean container (3× material volume)
- Degassing under 29 in. Hg vacuum is recommended for hand-mixed batches
- For automated dispensing, use static mixers and ensure equipment is free of contaminants (especially from condensation-cure silicones or sulphur-containing rubbers)
- Store components below 25–38°C (77–100°F) in sealed containers to maintain shelf life
Storage & Shelf Life
- Shelf life: 24 months in original, unopened containers
- Storage temperature: ≤ 38°C (100°F), protected from frost and moisture
Packaging Options
- Available in matched A/B kits in various sizes for manual or automated meter-mix-dispense systems. Ideal for both prototyping and high-volume production.
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QSIL™ 573 – (Grey) Thermally Conductive, Repairable Addition-Cure Silicone for Electronics Potting
QSIL 573 is a two-component, 100% solids, addition-cure silicone elastomer engineered for high-performance potting and encapsulation of sensitive electronic assemblies. With a 1:1 mix ratio by weight, it delivers excellent thermal conductivity (~0.9–1.19 W/m·K), robust mechanical protection, and reliable environmental sealing while remaining fully repairable for rework or component replacement.
Curing rapidly at elevated temperatures (e.g., 15 minutes at 150°C) or fully at room temperature in 24 hours, QSIL 573 forms a hard, durable elastomer (Shore A 55) with low modulus to minimise stress on delicate components. Its grey cured appearance and non-corrosive, platinum-cure chemistry make it ideal for power electronics, LED systems, automotive control units, and other applications requiring thermal management and long-term reliability.