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Bulk SilSo Lite 21025 Supplier in Australia & New Zealand - DC Products
  • Bulk SilSo Lite 21025 Supplier in Australia & New Zealand - DC Products

SilSo Lite 21025

SilSo Lite 21025

SilSo Lite 21025 – Fast-Cure, Self-Blowing Silicone Foam for Lightweight Electronics Potting

SilSo Lite 21025 is a two-component, platinum-cure, self-blowing silicone foam engineered for ultra-fast, low-pressure potting where weight reduction, thermal protection, and process efficiency are critical. Upon mixing, it expands 2–3× its dispensed volume via hydrogen gas generation, forming a closed-cell, opaque black foam with excellent flow and minimal internal pressure, ideal for sensitive electronics and complex assemblies.

With an ultra-fast 90-second gel time at 25°C, SilSo Lite 21025 is optimised for high-speed automated dispensing, enabling rapid cycle times in EV battery module production, PCB staking, and thermal insulation applications. Its hydrolytically stable, reversion-resistant chemistry ensures long-term reliability in harsh environments.

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SilSo Lite 21025

SilSo Lite 21025

SilSo Lite 21025 – Fast-Cure, Self-Blowing Silicone Foam for Lightweight Electronics Potting

SilSo Lite 21025 is a two-component, platinum-cure, self-blowing silicone foam engineered for ultra-fast, low-pressure potting where weight reduction, thermal protection, and process efficiency are critical. Upon mixing, it expands 2–3× its dispensed volume via hydrogen gas generation, forming a closed-cell, opaque black foam with excellent flow and minimal internal pressure, ideal for sensitive electronics and complex assemblies.

With an ultra-fast 90-second gel time at 25°C, SilSo Lite 21025 is optimised for high-speed automated dispensing, enabling rapid cycle times in EV battery module production, PCB staking, and thermal insulation applications. Its hydrolytically stable, reversion-resistant chemistry ensures long-term reliability in harsh environments.

 

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Video Link - SilSo Lite 21025 Silicone Foam Application

Key Features

  • Self-blowing expansion – 2–3× volume increase without external blowing agents
  • Ultra-fast gel time: 90 seconds at 25°C – ideal for high-throughput automation
  • Low foam density: 0.4 g/cm³, reduces system weight vs. solid silicones
  • Low-pressure rise – minimises stress on delicate components during foaming
  • Excellent flowability – fills intricate geometries before gelation
  • UL 94 V-0 rated – meets flammability requirements for electronics
  • Primerless adhesion – bonds directly to many substrates without surface treatment

Typical Applications

  • High-speed potting of EV battery modules and power electronics
  • PCB staking and component fixation require rapid handling strength
  • Thermal and acoustic insulation in automotive and aerospace systems
  • Encapsulation, where minimal cure pressure and fast demold are essential

Technical Notes

  • Mix ratio: 1:1 by volume (1.17:1 by weight)
  • Mixed viscosity: 17,000 cP
  • Cured colour: Opaque black
  • Max service temperature: 200°C (392°F)
  • Thermal conductivity: 0.067 W/m·K
  • Self-bonding: Yes – adheres to many substrates without primer
  • Inhibition sensitivity: Avoid contact with sulfur-, nitrogen-, tin-, or PVC-based materials

Processing Recommendations

  • Dispense by volume using static mixers (e.g., 32-element, 8 mm square)
  • Ideal dispense rate: 1–2 grams/second for uniform cell structure
  • Ambient temperature: 20–30°C (68–85°F) for optimal foam quality
  • Purge between dispenses: Recommended within ¼ of gel time (~22 seconds) to prevent nozzle clogging
  • Do not confine in sealed cavities without venting—internal pressure may build during expansion

Storage & Shelf Life

  • Shelf life: 12 months in original, unopened containers
  • Max storage temperature: 38°C (100°F)

Packaging Options

  • Available in matched A/B bulk kits for automated meter-mix-dispense systems.

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